Hanmi Semiconductor Unveiled HBM4 Equipment at Semicon West
The company debuted five new models for AI chip packaging at the Moscone Center.
Updated on Oct. 14, 2026 in Semiconductors
Live Poll
Are you concerned that the current AI manufacturing boom will drive up prices for everyday technology?
Tech professionals and semiconductor manufacturers gathered at the Moscone Center this week to view new production hardware for the next generation of AI chips. Hanmi Semiconductor introduced its latest TC Bonder technology to support the surging demand for HBM4 memory assembly.
Why it matters
As global memory manufacturers begin mass production of HBM4 this year, this specialized equipment aims to resolve bottlenecks in stacking semiconductors. The introduction reflects broader industry efforts to increase manufacturing capacity for AI hardware within the United States.
The Semicon West 2026 exhibition at the Moscone Center features over 1,500 booths. Hanmi Semiconductor used the event to launch five new models, including the TC Bonder 4, with additional equipment releases planned for 2027.
The players
Hanmi Semiconductor
A developer of semiconductor manufacturing equipment specializing in high-speed, precision bonding and cutting technology.
The details
The new TC Bonder 4 uses heat and pressure to stack memory semiconductors, while the three 2.5D TC Bonder and two FC Bonder models enable the integration of GPUs, CPUs, and HBM into a single package. Hanmi also showcased its Micro Saw & Vision Placement process, which automates cutting, cleaning, inspection, and sorting. The company plans to target the domestic foundry and back-end processing markets in the coming months.
Timeline
2021: Hanmi developed micro-saw technology.
October 13-15, 2026: Semicon West 2026 takes place in San Francisco.
2027: Wide TC Bonder is scheduled for release.
Across the Bay
This launch follows the industry trend of relocating and expanding critical back-end semiconductor processes into the United States to meet growing AI chip demand. It marks a push to establish local capacity for high-bandwidth memory production previously centered elsewhere.
The Semicon West exhibition concludes on October 15, 2026, at the Moscone Center. Residents in SoMa may notice increased traffic and visitor activity around the convention facility through the end of the event.
The takeaway
San Francisco continues to act as a key hub for global semiconductor manufacturing summits and hardware innovation. Watch for the 2027 commercial rollout of the Wide TC Bonder as a signal of the industry's progress in scaling HBM4 production.
Further reading
For more on the city's role in the hardware supply chain, visit our Semiconductors section.
Source note: This article includes information reported by 조선일보.
Live Poll
Are you concerned that the current AI manufacturing boom will drive up prices for everyday technology?
